Manz Asia Delivers World’s First 310mm Panel-Level Packaging ECD Production System
TAOYUAN: Semiconductor advanced packaging equipment manufacturer Manz Asia has achieved a major milestone by delivering the world’s first 310mm × 310mm Panel-Level Packaging (PLP) Electrochemical Deposition (ECD) mass production system.
The breakthrough expands the company’s advanced packaging portfolio and highlights its capabilities in process innovation, equipment engineering and high-volume manufacturing.
The newly introduced system is designed to support next-generation semiconductor packaging technologies, including Fan-Out Panel-Level Packaging (FOPLP), Chip-on-Panel-on-Substrate (CoPoS) and Through Glass Via (TGV), all of which are increasingly important for artificial intelligence (AI), high-performance computing (HPC) and high-bandwidth memory (HBM) applications.
According to Manz Asia, the ECD platform was developed with a high degree of flexibility, allowing it to support both glass and metal square carriers while integrating wet chemical process modules used in Redistribution Layer (RDL) fabrication.
The 310mm × 310mm panel format offers significant advantages in scalability, panel utilisation and production yield, making it a promising solution for the future of panel-level packaging.
The company believes the technology will play a crucial role in meeting growing demand for advanced semiconductor packaging as AI and data-intensive applications continue to expand globally.
In recent years, advanced packaging technologies have become increasingly intertwined with leading-edge semiconductor manufacturing, with Taiwan emerging as one of the world’s key production hubs.
This shift has accelerated the need for packaging solutions that are more efficient, scalable and capable of supporting mass production.
To address these requirements, Manz Asia has strengthened its in-house research and development capabilities while working closely with major integrated device manufacturers (IDMs) and packaging companies.
The Omni 310x platform integrates a full range of wet chemical process modules, including cleaning, developing, etching and stripping processes.
It also supports both spin and spray processing methods, enabling a comprehensive solution for RDL manufacturing on a 310mm × 310mm panel format.
Beyond the Omni 310x, Manz Asia’s Omni x-series now includes the Omni 510x platform, measuring 510mm × 515mm, and the larger Omni 700x, sized at 700mm × 700mm.
The modular architecture allows customers to customise systems according to device designs, manufacturing processes and production capacity requirements, supporting everything from research and pilot production to full-scale manufacturing.
Manz Asia chief executive officer Robert Lin said the successful deployment of the Omni 310x demonstrates increasing market demand for advanced packaging platforms that combine flexibility with manufacturing readiness.
“As advanced packaging becomes increasingly important for AI and HPC architectures, capabilities such as process control, scalability and seamless integration into high-volume manufacturing have become key competitive differentiators,” he said.
Lin added that the company will continue strengthening its ECD and wet chemical processing technologies to improve manufacturing efficiency, yield stability and production ramp-up.
He said Manz Asia’s multi-platform strategy provides customers with a clear technology pathway from process development to high-volume manufacturing, enabling efficient and sustainable capacity expansion for the next generation of semiconductor packaging technologies.
