FotoNation and SEMIFIVE Strengthen Edge AI Innovation Through TriSilica Chip Development
GALWAY: FotoNation has entered a strategic partnership with SEMIFIVE to accelerate the development and commercialisation of the TriSilica artificial intelligence (AI) chip family using fabrication technology from Samsung Foundry.
Under the collaboration, SEMIFIVE will lead turnkey development for TriSilica, an ultra-low-power AI chip platform specifically designed for edge AI applications and next-generation intelligent sensor technologies.
TriSilica is being developed as a compact AI silicon platform with minimal power consumption while supporting multiple sensor inputs including audio, mmWave, spectral, infrared and RGB technologies.
The technology enables AI processing to be carried out directly on devices without relying heavily on cloud computing systems or large-scale data centres.
SEMIFIVE chief executive officer and co-founder Brandon Cho said FotoNation is among the early innovators in device-based image processing and visual AI technologies.
According to him, the collaboration will help accelerate the transformation of FotoNation’s TriSense IP Core technology into high-performance silicon solutions suitable for the growing global edge AI market.
He described the project as an important step in expanding SEMIFIVE’s influence within the European semiconductor market after establishing operations in the United States, China, Japan and India.
SEMIFIVE also stated that its expertise in low-power chip design and advanced integrated semiconductor packaging technologies was a key reason the company was selected as development partner for the project.
Meanwhile, FotoNation chief executive officer Petronel Bigioi said the collaboration is expected to become an important driver in commercialising the company’s next-generation AI sensor-fusion chips.
According to him, demand for intelligent image processing and sensor-fusion technologies continues to rise alongside the rapid growth of the global edge AI industry.
The first product under the collaboration, known as TS-210, is scheduled to enter the Multi-Project Wafer (MPW) phase by the end of this year.
The chip will be developed using Samsung Foundry’s 8nm Low Power Ultimate (8LPU) process, which is designed to deliver high performance with improved energy efficiency.
-wilayah.com.my
