Longsys Debuts Integrated AI Storage Technologies at MWC 2026
BARCELONA — Semiconductor memory specialist Longsys has unveiled its latest embedded storage innovations designed to support the growing demand for on-device artificial intelligence during Mobile World Congress 2026.
The company presented its technology under the theme “AI Storage for the Mobile World”, demonstrating how advanced storage architectures can enhance AI capabilities directly on smartphones, wearable devices, personal computers and robotics platforms.
Industry analysts note that the rapid expansion of AI applications across consumer electronics is driving the need for storage systems capable of handling higher data throughput, improved energy efficiency and deeper integration between hardware and software.
Longsys said its technologies are designed to address these requirements while supporting the next wave of AI-powered devices.
By leveraging expertise in controller design, firmware algorithms, advanced semiconductor packaging and manufacturing processes, the company is transitioning from a conventional storage supplier into a branded semiconductor memory enterprise delivering integrated solutions.
At MWC 2026, Longsys demonstrated multiple storage platforms supporting AI mobile devices, AI wearables, AI PCs and embodied robotic systems.
Advanced Storage for AI Mobile Devices
Among the key highlights is the company’s proprietary High Level Cache (HLC) technology integrated into UFS storage modules.
The innovation enables UFS storage to manage certain types of data traditionally handled by DRAM, reducing the overall DRAM requirements in AI smartphones and tablets.
This design helps device manufacturers optimise bill-of-material costs while maintaining seamless performance and user experience.
Longsys also introduced pTLC technology in its UFS lineup, allowing intelligent switching between QLC, TLC and SLC modes through firmware control.
The technology provides TLC-grade data retention with improved cost efficiency, offering a balance between storage capacity, durability and performance for AI-intensive workloads.
Compact Storage Solutions for AI Wearables
With AI wearables rapidly gaining traction, Longsys also highlighted compact storage solutions including ePOP5x, ePOP4x and Subsize eMMC modules.
The flagship ePOP5x module retains the same footprint as previous versions but reduces thickness by 35 percent to just 0.52 millimetres.
It also doubles DRAM speed to 8533Mbps and supports flexible capacity configurations, making it suitable for next-generation smart glasses and wearable computing devices.
High-Speed Storage Platforms for AI PCs
For AI personal computers, Longsys showcased its high-bandwidth, low-latency mSSD storage medium designed to handle real-time data processing.
Building on this platform, the company’s consumer storage brand Lexar has developed the industry’s first AI Storage Core architecture.
The system enables flexible, high-capacity and hot-swappable storage configurations tailored for demanding AI computing workloads.
New products built on the architecture include the AI-Grade Storage Stick designed for AI laptops and the AI-Grade SSD engineered for high-performance AI tasks.
With end-to-end capabilities spanning controller design, firmware development, storage media research and manufacturing, Longsys aims to build a comprehensive AI storage ecosystem capable of supporting the growing demands of the on-device AI era.
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